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Phenol Resin

Impregnation / Electronic Materials / Abrasives / Phenolic Foam / Other

Phenol Resin
01

Impregnation

Features

  • Excellent substrate penetration, with outstanding heat resistance, chemical resistance, mechanical strength and workability.

Applications

Penetrates the inner structure of substrates such as paper, wood and fiber to enhance the adhesion, strength and heat resistance of the final product. Mainly used in the manufacture of HPM (High Pressure Melamine) for furniture finishing materials, processed through impregnation, drying, lamination and press steps. Various properties can be implemented according to customer requirements.

Specifications

  • PR-100

    Solid Content(%)
    53~55
    Viscosity(sec)
    17~19
    pH
    8.0~9.0
    Applications & Features
    General Type HPM
  • PR-150Y

    Solid Content(%)
    53~55
    Viscosity(sec)
    17~19
    pH
    8.0~9.0
    Applications & Features
    Bright Color HPM
  • PR-250D

    Solid Content(%)
    51~53
    Viscosity(sec)
    16~18
    pH
    8.0~9.0
    Applications & Features
    Post Forming Type HPM
02

Electronic Materials

Features

  • Excellent substrate penetration and insulation performance. Minimal bending or warping under heat, with robust mechanical strength.

Applications

Used in the manufacture of Bakelite, processed in plate form by impregnating phenol resin on paper, cotton cloth, glass cloth, etc. and then applying heat and pressure. Main applications include insulation plates for electronic components such as PCBs, sockets, plugs and switches, as well as Back-up Boards for drill processing.

Specifications

  • KR-40

    Solid Content(%)
    50~52
    Viscosity(sec)
    17~19
    pH
    8.0~9.0
    Applications & Features
    Bakelite(General)
  • KR-80

    Solid Content(%)
    51~53
    Viscosity(sec)
    17~19
    pH
    8.0~9.0
    Applications & Features
    Bakelite(High strength)
03

Abrasives

Features

  • Excellent adhesion performance with strong heat strength, mechanical strength and physicochemical stability.

Applications

Used as a binder to bond granular or powder-form high-hardness abrasive materials to substrates such as paper or cloth.

04

Phenolic Foam

Features

  • Excellent heat resistance with almost no thermal deformation at high temperatures. Generates minimal smoke and toxic gas during thermal decomposition.

Applications

Used as an alternative material that addresses the flammability and toxic gas issues of conventional insulation materials such as polystyrene foam and polyurethane foam. We produce and supply foaming phenol resin for phenolic foam manufacturing.

Specifications

  • UPF-800

    Solid Content(%)
    78~83
    Viscosity(sec)
    3,500~5,000
    pH
    6.0~8.0
    Applications & Features
    General
05

Other

Features

  • Easy viscosity adjustment with excellent heat resistance and bonding strength.

Applications

Used as a binder for inorganic refractory materials that must maintain strength in high-temperature environments above 1,000°C. Applied to the manufacture of various refractory products through kneading and molding processes with raw materials.

Specifications

  • PF-100

    Solid Content(%)
    56~58
    Viscosity(sec)
    18~20
    pH
    8.0~9.0
    Applications & Features
    Brake pad